R6011ENJ
10 V Antriebs-Nch-MOSFET

MOSFETs mit Leistung sind so entwickelt, dass sie durch einen niedrigen Einschaltwiderstand mithilfe von Mikrobearbeitungstechnologien für eine Vielzahl von Anwendungen geeignet sind. Das breit aufgestellte Sortiment umfasst kompakte, hochleistungsfähige und komplexe Ausführungen, um unterschiedliche Marktbedürfnisse zu erfüllen.

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Produktdetails

 
Teilenummer | R6011ENJTL
Status | Empfohlen
Gehäuse | LPTS (D2PAK)
Einheitenmenge | 1000
Minimale Gehäusemenge | 1000
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

TO-263 (D2PAK)

Package Size [mm]

10.1x13.1 (t=4.5)

JEITA Package

SC-83

Applications

Power Supply

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

600

Drain Current ID[A]

11.0

RDS(on)[Ω] VGS=10V(Typ.)

0.34

RDS(on)[Ω] VGS=Drive (Typ.)

0.34

Total gate charge Qg[nC]

32.0

Power Dissipation (PD)[W]

40.0

Drive Voltage[V]

10.0

Trr (Typ.)[ns]

430

Mounting Style

Surface mount

Bare Die Part Number

Available: K7403

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on-resistance
  • Fast switching speed
  • Gate-source voltage (VGSS) guaranteed to be ±20V
  • Drive circuits can be simple
  • Parallel use is easy
  • Pb-free lead plating ; RoHS compliant

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Models

  • R6011ENJ SPICE Model
  • R6011ENJ Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations