RD3L08BGN
Nch 60V 80A Leistungs-MOSFET

Der RD3L08BGN ist ein Leistungs-MOSFET für Schaltanwendungen.

Data Sheet Kaufen *
* Dieses Produkt entspricht der Standardqualifizierung.
Für den Automobilbereich kontaktieren Sie bitte unser Sales-Team.
Data Sheet Kaufen *
  • Design Tools  
  • Packaging & Qualität  
  • FAQs
  • Kontakt

Produktdetails

 
Teilenummer | RD3L08BGNTL
Status | Empfohlen
Gehäuse | TO-252
Einheitenmenge | 2500
Minimale Gehäusemenge | 2500
Gehäusetyp | Taping
RoHS | Ja

Spezifikationen:

Grade

Standard

Package Code

TO-252 (DPAK)

JEITA Package

SC-63

Package Size[mm]

6.6x10.0 (t=2.3)

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

60

Drain Current ID[A]

80.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.0057

RDS(on)[Ω] VGS=10V(Typ.)

0.0042

RDS(on)[Ω] VGS=Drive (Typ.)

0.0057

Total gate charge Qg[nC]

38.0

Power Dissipation (PD)[W]

119.0

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

Eigenschaften:

  • Low on - resistance
  • High power small mold package (TO-252)
  • Pb-free lead plating ; RoHS compliant
  • Halogen free
  • 100% Rg and UIS tested
SHOW/HIDE COLUMNS
Liste neuer Produkte

Ressourcen entwerfen

 

Technische Artikel

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Design Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • RD3L08BGN SPICE Model

Characteristics Data

  • RD3L08BGN ESD Data

Packaging & Qualität

Package Information

  • Package Dimensions
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations